发明名称 REMOTE THERMAL COMPENSATION ASSEMBLY
摘要 A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.
申请公布号 US2013193850(A1) 申请公布日期 2013.08.01
申请号 US201213358938 申请日期 2012.01.26
申请人 DEMUYNCK RANDY;PROGL CURT 发明人 DEMUYNCK RANDY;PROGL CURT
分类号 H05B37/02 主分类号 H05B37/02
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