发明名称 PCB WITH HEATPIPE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A PCB(Printed Circuit Board) with a heat pipe and a manufacturing method thereof are provided to use a hot press method to attach a heat pipe to a flexible PCB, thereby preventing the heat pipe from being damaged during formation. CONSTITUTION: A circuit is formed on a copper layer. A flat-type heat pipe(20) has a channel inside and fluid within the channel. A high-K dielectric layer(30) is formed on the top of the heat pipe. A flexible PCB(10) is formed on the top of the high-K dielectric layer. The heat pipe and the flexible PCB are attached to each other by a hot press method for forming a PCB with a heat pipe.
申请公布号 KR101292045(B1) 申请公布日期 2013.08.01
申请号 KR20110122581 申请日期 2011.11.23
申请人 发明人
分类号 F28D15/02;H05K1/02;H05K7/20 主分类号 F28D15/02
代理机构 代理人
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