| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic instruments, exhibiting appropriate adhesive force and fluidity on pasting it on an adherend, excellent in processability and also showing the less reduction of the adhesive force on peeling at a high temperature after thermal curing as compared with the adhesive force on peeling at normal temperature.SOLUTION: An adhesive composition for electronic instruments includes (A) a polyfunctional epoxy resin liquid at normal temperature, having an amine type glycidyl group and an ether bond, (B) an epoxy resin solid at normal temperature and (C) a thermoplastic resin having a functional group crosslinking with the epoxy resin, and includes 30 to 50 wt.% of (A) the epoxy resin liquid at normal temperatures having the amine type glycidyl group and ether bond, and 50 to 70 wt.% of (B) the epoxy resin solid at the normal temperature based on 100 wt.% of the total amount of the epoxy resins. |
