| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing an external connection terminal located below a corner part of a semiconductor chip mounted on a wiring board from breaking due to a temperature cycle without increasing the size of the wiring board.SOLUTION: A semiconductor device 10 comprises: a first semiconductor chip 14; a wiring board 11 having a wiring pattern 22 disposed on one surface and electrically connected to the first semiconductor chip 14 and a plurality of lands disposed on the other surface and electrically connected to the wiring pattern 22; and first to third external connection terminals 12A, 12B, and 12C provided on the plurality of lands. The wiring board 11 includes a stress dispersion pattern 27 facing the first external connection terminal 12A located below a corner part 14A of the first semiconductor chip 14 and the second external connection terminal 12B disposed outside the corner part 14A. |
