| 摘要 |
A package testing system or apparatus that may be mounted directly onto an F/F/S machine and allows for communication with an F/F/S machine in the form of either a digital or analog signal. The communication may be implemented into a PID loop which allows for a predetermined burst pressure set point to be reached "automatically" by either the burst pressure controller or the F/F/S controller to automatically adjust the sealing parameters via the PID loop. The system may employ a novel sealing system that uses either a viscous solution or a series of laminated materials to seal either the needle entry point or the puncture side of the material in its entirety, thereby eliminating the use of known sealing patches that cover the porous webbing in testing. Methods for conducting such testing and for operating such systems are within the scope of the present disclosure.
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