The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
申请公布号
EP1997176(A4)
申请公布日期
2013.07.31
申请号
EP20070779831
申请日期
2007.03.16
申请人
INFINITE POWER SOLUTIONS, INC.
发明人
SNYDER, SHAWN W.;NEUDECKER, BERND J.;BRANTNER, PAUL C.
