SEMICONDUCTOR DEVICE AND METHOD OF FORMING BASE LEADS FROM BASE SUBSTRATE AS STANDOFF FOR STACKING SEMICONDUCTOR DIE

摘要

Abstract SEMICONDUCTOR DEVICE AND METHOD OF FORMING BASE LEADS FROM BASESUBSTRATE AS STANDOFF FOR STACKING SEMICONDUCTOR DIEA semiconductor device has a base substrate with first and second opposing surfaces. A first etch-resistant conductive layer is formed over the first surface of the base substrate. A second etch-resistant conductive layer is formed over the second surface of the base substrate. A first semiconductor die has bumps formed over contact pads on an active surface of the first die. The first die is mounted over a first surface of the first conductive layer. An encapsulant is deposited over the first die and base substrate. A portion of the base substrate is removed to form electrically isolated base leads between opposing portions of the first and second conductive layers. A second semiconductor die is mounted over the encapsulant and a second surface of the first conductive layer between the base Leads. A height of the base leads is greater than a thickness of the second die.(Fig. 5)