发明名称 METHOD FOR RESIN MOLDING AND RESIN MOLDING APPARATUS
摘要 <p>52The method is capable of resin-molding one side face of a work (W) in a molding die set (1), in which the work (W) is sucked and held on at least one of clamping faces and resin-molded in a cavity concave section (4). The method comprises the steps of: sucking and holding a release film (12) which covers at least one of the clamping faces of the molding die set (1); setting the work (W) in the molding die set (1); sucking the other side face of the work (W) through a work sucking hole (12g) of the release film (12), which is formed before or after holding the release film (12), so as to hold the work (W) on the clamping face; closing the molding die set (1) so as to clamp the work (W); and pressurizing and heating the resin (24), which has been accommodated in the cavity concave section (4), with resin (24).FIGURE 2</p>
申请公布号 SG191479(A1) 申请公布日期 2013.07.31
申请号 SG20120085411 申请日期 2012.11.21
申请人 APIC YAMADA CORPORATION 发明人 SHUSAKU TAGAMI;YOSHIKAZU MURAMATSU;MASANORI MAEKAWA;HIDEAKI NAKAZAWA;MASAHIKO FUJISAWA;TAKUYA MIYAMOTO
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