| 摘要 |
A semiconductor laser device having stable heat dissipation property is provided. The semiconductor laser device 100 includes a semiconductor laser element 10, a mounting body 30 on which the semiconductor laser element 10 is mounted, and a base body 40 connected to the mounting body 30. The base body 40 has a recess configured to engage with the mounting body 30 and a through portion penetrating through a part of a bottom of the recess. In the specification, the remainder, which is a part of the bottom of the recess except for the through portion has a thickness equal or less than alf of the largest thickness of the base body 40. The lowermost surface of the mounting body 30 is spaced apart from the lowermost surface of the base body 40 through the remainder. |
