发明名称 |
METHOD OF JOINING COMPONENTS |
摘要 |
A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away. |
申请公布号 |
EP1275146(B1) |
申请公布日期 |
2013.07.31 |
申请号 |
EP20010942791 |
申请日期 |
2001.01.17 |
申请人 |
FAUN DATA AB |
发明人 |
KAELVESTEN, EDOUARD;STEMME, GOERAN;NJKLAUS, FRANK |
分类号 |
G01J1/02;H01L21/70;G01J5/02;H01L21/20;H01L21/60;H01L21/68;H01L21/683;H01L21/98;H01L25/16;H01L27/14;H01L37/00 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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