Wiring substrate, light emitting device, and manufacturing method of wiring substrate

摘要

There is provided a wiring substrate. The wiring substrate includes: a heat sink (10); a first insulating layer (20) on the heat sink; a wiring pattern (30) on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer (60) on the first insulating layer such that the wiring pattern is exposed from the second insulating layer.