发明名称 Inductive bond-wire circuit
摘要 <p>A bond wire circuit includes bond wires arranged relatively to provide a selected inductance. In connection with various example embodiments, respective bond wire loops including forward and return current paths are arranged orthogonally. Each loop includes a forward bond wire connecting an input terminal with an intermediate terminal, and a return bond wire connecting the intermediate terminal to an output terminal. The return bond wires generally mitigate return current flow from the intermediate terminal in an underlying substrate. In some implementations, the loops are arranged such that current flowing in each of the respective loops generates equal and self-cancelling current in the other of the respective loops.</p>
申请公布号 EP2393111(B1) 申请公布日期 2013.07.31
申请号 EP20110168190 申请日期 2011.05.31
申请人 NXP B.V. 发明人 BLEDNOV, IGOR
分类号 H01L23/49;H01L23/52;H01L23/64;H01L23/66;H01L27/04;H03F1/02;H03F1/56 主分类号 H01L23/49
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