| 摘要 |
<p>A lead wire connection apparatus includes tape attaching means (13) for simultaneously attaching adhesive, electrically conductive tapes to an upper surface and a lower surface of a semiconductor cell which is fed from a feed module (12); convey means (14) for pitch-feeding the semiconductor cell to which the conductive tapes have been attached; lead wire processing means (15a. to 15d) for forming-processing the lead wire; provisional pressure-bonding means (15) which is provided at a part opposed to the semiconductor cell that is pitch-fed, holds the lead wires which are forming-processed, repeats provisional pressure-bonding of the lead wires to the conductive tapes provided on the upper surface and lower surface of the semiconductor cell that is pitch-fed, and alternately connects the upper surfaces and lower surfaces of the neighboring semiconductor cells; and main pressure-bonding means (16) which is disposed on a downstream side of the provisional pressure-bonding means in a direction of conveyance of the semiconductor cell, and which mainly pressure-bonds, simultaneously, the paired upper and lower lead wires which have been provisionally pressure-bonded to the upper surface and lower surface of the semiconductor cell.</p> |
