LASER PROCESSING METHOD FOR BRITTLE MATERIAL SUBSTRATE AND LASER PROCESSING DEVICE FOR BRITTLE MATERIAL SUBSTRATE

摘要

PURPOSE: A laser processing method of a brittle material substrate is provided to reduce chipping on a substrate surface when executing a drilling process on the brittle material substrate with a laser by making a back and a front of a glass substrate as a beginning surface of the process and an inside of the substrate as a finishing surface. CONSTITUTION: A laser processing apparatus of a brittle material substrate is equipped with a table, a laser irradiating head, and a transfer mechanism. A laser processing method of the brittle material substrate includes the following steps; (i) a drilling process is performed up to certain depth from a back of the substrate irradiating the laser from the surface of the brittle material substrate and moving light concentrating position of the laser from the back of the brittle material substrate to the surface; and (ii) a drilling process is performed which connects to a hole formed by the (i) process moving light collecting position of the laser from the surface of the brittle material substrate to the back. [Reference numerals] (AA) Processing area; (BB) Processing hole diameter