| 摘要 |
PROBLEM TO BE SOLVED: To provide a package configuration which easily achieves compact, low height and three-dimensional packaging to meet requirements for high performance and more pins of a semiconductor required for mobile equipment which is compact, low profile, lightweight, high-definition, multi-functional, etc. SOLUTION: The three-dimensional printed circuit board consists of an upper substrate, a lower substrate and a connection layer with a thickness of 30 to 300μm for connecting the upper substrate to the lower substrate. The shapes of the upper substrate and the lower substrate are different from each other. The connection layer is composed of an insulating layer formed by dispersing an inorganic filler in the thermosetting resin and has a via hole formed by boring a through-hole in the insulating layer at a predetermined position and filled with a charging conductive paste. In the three-dimensional printed circuit boar, a recess is formed by stacking the upper substrate and the lower substrate and the upper substrate and the connection layer are formed so as to have a curved surface within a range from the wall and the peripheral of the recess to a most nearby via land edge. COPYRIGHT: (C)2010,JPO&INPIT |
