| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device which can reduce consumption of a mold releasing film, and simplify and reduce the cost of a resin sealing device itself by simplifying a mechanism for temporarily molding a powder particulate resin. SOLUTION: The resin sealing device 100 temporarily molds the powder particulate resin 102 and resin-seals an article to be molded by using a temporarily molded resin 106. The resin sealing device includes the mold releasing film 116 having the powder particulate resin 102 to be mounted thereon, a hot plate 128 which heats the mounted surface of the mold releasing film side of the powder particulate resin 102 to soften by rising the temperature of the powder particulate resin 102, and a cooling plate 130 which temporarily molds by abutting to the opened surface at the anti-mold releasing film side of the softened powder particulate resin 102 and sandwiching the softened powder particulate resin 102 with the hot plate 128 and decreases the temperature of the opened surface of the powder particulate resin 102, to temporarily mold the powder particulate resin 102. COPYRIGHT: (C)2011,JPO&INPIT |
