发明名称 HIGH FREQUENCY WIRING BOARD
摘要 A high frequency wiring board (4) includes a dielectric substrate (4a), a line conductor (4b) for high frequency signal transmission formed on a first surface of the dielectric substrate (4a) from a connection end (4bc) to an end (4ba), a ground conductor (4c) which is disposed aligned with one side (4bb) of the line conductor (4b) with a distance therebetween, and is disposed so as to cross over a hypothetical extension line extending from the end (4ba) in parallel with a line direction of the line conductor (4b), and a terminating resistor (4d) configured to electrically connect an end portion of the line conductor (4b) and the ground conductor (4c).
申请公布号 EP2246884(B1) 申请公布日期 2013.07.31
申请号 EP20090706773 申请日期 2009.01.30
申请人 KYOCERA CORPORATION 发明人 SHIRASAKI, TAKAYUKI
分类号 H01L23/12;H01L23/02;H01L23/64;H01L23/66;H05K9/00 主分类号 H01L23/12
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