| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photopolymerizable resin composition having high sensitivity to light around 405 nm wavelength and having good photo-curable property with excellent chemical resistance and adhesiveness without carrying out a heat treatment after exposure, and also to provide a photosensitive lithographic printing plate material excellent in plate wear and durability against a cleaner liquid, by using the composition. <P>SOLUTION: The photopolymerizable resin composition contains: (A) a compound expressed by a general formula I or a specified compound having two trihaloalkyl-substituted s-triazine cyclic groups; (B) an organic boron salt compound; (C) a sensitizing dye having absorption in a wavelength range from 380 to 410 nm; (D) a polymerizable compound; and (E) a binder polymer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
