| 摘要 |
The invention relates to a printed circuit board (PCB) with an insulated micro radiator. The PCB comprises a PCB substrate, wherein the PCB substrate includes sequentially crossing laminated multi insulating layers clad with copper circuit layers and multi solidified insulating layers; the PCB with the insulated micro radiator further includes a cylindrical insulated micro radiator embedded in a cylindrical through hole of the PCB substrate; the height of the insulated micro radiator, with top and bottom surfaces both clad with the copper patterns, is equal to the thickness of the PCB substrate, wherein the top surface is provided with a heating component, and the bottom surface is insulated from the copper circuit layers of the PCB. The PCB has the advantages of high thermal conductivity and heat transfer stability of the insulated micro radiator as well as the advantages of flexible routing and reliable electrical connection of the conventional PCB. Moreover, it can transmit the heat generated by the heating component such as an LED and so on out of the PCB during operation, timely and effectively. Therefore, it is an ideal carrier board of the heating component and an array thereof. |
