| 发明名称 |
HOUSING FOR AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT |
| 摘要 |
<p>A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.</p> |
| 申请公布号 |
EP2619859(A1) |
申请公布日期 |
2013.07.31 |
| 申请号 |
EP20110755076 |
申请日期 |
2011.09.13 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
MOELLMER, FRANK;ARZBERGER, MARKUS;SCHWIND, MICHAEL;HOEFER, THOMAS |
| 分类号 |
H01S5/022;H01L33/48;H01L33/64;H01S5/024 |
主分类号 |
H01S5/022 |
| 代理机构 |
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