CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING CURED ARTICLE AND USE OF THE METHOD FOR PRODUCING FUNCTIONAL DEVICE,申请号EP20040799821-传众专利搜索

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发明名称	CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING CURED ARTICLE AND USE OF THE METHOD FOR PRODUCING FUNCTIONAL DEVICE
摘要
申请公布号	EP1687678(B1)	申请公布日期	2013.07.31
申请号	EP20040799821	申请日期	2004.11.18
申请人	TOKYO OHKA KOGYO CO., LTD.	发明人	TAKAHASHI, TORU;KATSUMATA, NAOYA;MAEDA, HIROKI
分类号	G03F7/004;G03F7/032;G03F7/039;H05K1/00;H05K3/28	主分类号	G03F7/004
代理机构		代理人
主权项
地址

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