| 摘要 |
A method and apparatus for packaging a surface acoustic wave transponder for use in harsh environments is provided. An exemplary transponder comprises a surface acoustic wave piezoelectric device, wire bonds, an antenna element, an antenna substrate, a dome structure, and casing. The exemplary surface acoustic wave piezoelectric device is attached directly onto the antenna substrate and wire bonded to an antenna element. The surface acoustic wave piezoelectric device is protected under the dome structure, which is sealed and attached to the antenna substrate. The components are encased and sealed within a transponder casing. The transponder may be part of or incorporated into substantially any shape or form factor.
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