发明名称 Polishing pad, polishing method and method of forming polishing pad
摘要 A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.
申请公布号 US8496512(B2) 申请公布日期 2013.07.30
申请号 US201213648971 申请日期 2012.10.10
申请人 IV TECHNOLOGIES CO., LTD. 发明人 WANG YU-PIAO
分类号 B24B1/00 主分类号 B24B1/00
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