| 摘要 |
PURPOSE: A light sealing hardening method is provided to reduce the bending degree of a circuit board by reducing heat generated in a hardening process of a sealing board which is weak from the heat. CONSTITUTION: A single wavelength ultraviolet (UV) light source device emits UV light to a surface of a sealing board (20) sealing a lower board and an upper board to harden the sealing board. A multi-wavelength UV light source device secondly hardens the hardened sealing board by emitting the UV light to the surface of the hardened sealing board. |
