发明名称 METHOD FOR HEATING INTERGATED CIRCUIT AT LOW-TEMPERATURE AND DEVICES USING THE METHOD
摘要 PURPOSE: A method for heating an integrated circuit at low temperature and apparatuses capable of performing the method are provided to sense temperature of the integrated circuit at the low temperature and then to heat the integrated circuit according to the sensing result. CONSTITUTION: A thermal sensor (22) senses temperature of an integrated circuit. The thermal sensor outputs a comparison signal by comparing the sensed temperature with reference temperature. A heating element (24) heats the integrated circuit. The heating element is enabled or disabled on the basis of the comparison signal. The thermal sensor and the heating element are enabled or disabled in response to at least one control signal inputted from the outside of the integrated circuit.
申请公布号 KR20130085670(A) 申请公布日期 2013.07.30
申请号 KR20120006613 申请日期 2012.01.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, MI SOOK;PARK, SHIN KYU
分类号 G06F1/00;H03K17/14 主分类号 G06F1/00
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