| 摘要 |
Disclosed is a positive photosensitive insulating resin composition including:
(A) an alkali soluble resin,
(B) a compound having a quinonediazide group, and
(C) an epoxy resin having a softening point of not lower than 30°C; and a cured product which is obtained by curing the composition. The cured product obtained by curing the composition is excellent in resolution, electrical insulation, thermal shock resistance and adhesion, and exhibits reduced deformation after post-baking. |
