发明名称 WAFER MARKING SYSTEM
摘要 PURPOSE: A water marking system is provided to irradiate a laser beam to a precise location by adjusting a position of the system by moving a stage. CONSTITUTION: A precise stage linearly moves in X-axis and Y-axis and rotates with respect to Z-axis as a rotation shaft to move a marking position to a laser irradiation position. Vacuum grooves of a circle shape are formed in the stage in a hook shape. An attenuator controls intensity from outside a laser. A camera adapter is attached between a scanner and the attenuator and monitors a position where the laser falls down on a substrate. [Reference numerals] (AA) F-theta lens correction: 1 μm → 0 μm
申请公布号 KR20130085801(A) 申请公布日期 2013.07.30
申请号 KR20120006880 申请日期 2012.01.20
申请人 DNA CO., LTD. 发明人 KIM, DAE JIN
分类号 H01L21/02;H01L21/68 主分类号 H01L21/02
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