发明名称 Devices having a cavity structure and related methods
摘要 A method of making a device. The method comprises providing a first layer including a first material on a surface of a substrate, removing a portion of the first layer and a corresponding portion of the substrate to form an opening in the first layer and a recessed portion in the surface of the substrate, and supplying a liquid mixture to the opening and the recessed portion. The liquid mixture includes a first component having a first chemical affinity to the first material and a second component having a second chemical affinity to the first material, which is smaller than the first chemical affinity. The method also includes removing the second component and forming a second layer including the first component. The second layer covers the recessed portion and adheres to an edge portion of the first layer, such that the second layer and the recessed portion define a cavity.
申请公布号 US8497183(B2) 申请公布日期 2013.07.30
申请号 US20100662681 申请日期 2010.04.28
申请人 CHOU YOU-HUA;KO HSIANG HSIANG;CHANG HUNG JUI;CHEN YI MING;LIN HSIEN-WEI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHOU YOU-HUA;KO HSIANG HSIANG;CHANG HUNG JUI;CHEN YI MING;LIN HSIEN-WEI
分类号 H01L21/76 主分类号 H01L21/76
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