Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured.
申请公布号
US8497162(B1)
申请公布日期
2013.07.30
申请号
US20060379741
申请日期
2006.04.21
申请人
TOO SEAH SUN;TOUZELBAEV MAXAT;KIRKLAND JANET;ADVANCED MICRO DEVICES, INC.