| 摘要 |
In one implementation, a high power semiconductor package is configured as a buck converter including a control transistor and a sync transistor disposed on a leadframe, a flip chip driver integrated circuit (IC) for driving the control and sync transistors, and conductive clips electrically coupling the top surfaces of the transistors to substrate pads such as leadframe pads. The source of the control transistor is electrically coupled to the drain of the sync transistor using the leadframe and one of the transistor conductive clips. In this manner, the leadframe and the conductive clips provide efficient current conduction by direct mechanical connection and large surface area conduction, thereby enabling a package with significantly reduced electrical resistance, form factor, complexity, and cost.
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