| 摘要 |
The resin molding apparatus 100 comprises a pair of metal molds 10 and 20 respectively arranged so as to be insulated from the ground with insulating materials 11 and 21, and a molding part 40 which is formed by a pair of metal molds 10 and 20 and to which a resin material 30 is provided. At least one metal mold 10 of the pair of metal molds 10 and 20 is provided with electrodes 50 and 60 at two points flanking the molding part 40. A high frequency current generator 70 capable of applying high frequency current having a frequency of 10 kHz or more is connected to the two electrodes 50 and 60. |
