INSPECTION APPARATUS

摘要

PURPOSE: A testing device is provided to reduce design costs of a probe circuit board by reducing noise between the wirings. CONSTITUTION: A testing device comprises a probe card (2), a test head (17). The probe card includes a plurality of probes touching to a plurality of electrodes of each chip corresponding to a testing target chip of a semiconductor wafer. The test head applies a testing signal from the testing device to each probe by electrically connecting to each probe of the probe cards. The testing device constructs a plurality of array regions and a plurality of tester lands (37). The tester lands of the probe circuit board are individually connected to the plurality of the probes. The plurality of the array regions divides a plurality of electric contact units (29) according to a testing target chip.