| 摘要 |
A substrate processing apparatus is provided to uniformly supply the heat of a heated substrate processing unit to a substrate by forming an unevenness part in a region of a substrate placing unit on which the substrate is placed. A gas injection unit injects gas to the inside of a chamber(100). A substrate placing unit(200) on which a plurality of substrate placing parts(220) are placed is installed in the chamber. An optical heating unit is installed under a substrate placing unit, including a plurality of lamp heaters that are arranged as a plurality circular types with a single center so as to heat the substrate placing unit. The lamp heater can include a tube-type body whose inside is empty, a filament installed in the body, and a power applying terminal connected to the filament wherein the power applying terminal is installed across both ends of the body. |
