| 摘要 |
<p>[Problem] To provide: a chip capacitor that is capable of easily and rapidly accommodating a plurality of types of capacitance values using a common design; and a method for manufacturing said chip capacitor. [Solution] A chip capacitor (1) includes a substrate (2), a first external electrode (3) positioned on the substrate (2), a second external electrode (4), capacitor elements (C1 to C19) and fuses (F1 to F9). The capacitor elements (C1 to C19): include a first electrode film, a first capacitor film (12) on the first electrode film (11), a second electrode film (13) on the first capacitor film (12) and facing the first electrode film (11), a second capacitor film (17) on the second electrode film (13), and a third electrode film (16) on the second capacitor film (17) and facing the second electrode film (13); and are connected between the first external electrode (3) and the second external electrode (4). The fuses (F1 to F9) are each disposed between the capacitor elements (C1 to C19) and the first external electrode (3) or the second external electrode (4), and are able to cut off each of the plurality of capacitor elements (C1 to C19).</p> |
