发明名称 |
CONDUCTIVE FILLER OF FLAKE FORM |
摘要 |
<p>The present invention provides a conductive filler of flake form which is easy to produce and inexpensive, and which has high conductivity. This conductive filler of flake form is characterized by containing a base material of flake form, and a silver coating which coats the entire surface of the base material of flake form, the base material of flake form containing copper, and the conductive filler of flake form having a ratio a/b of peak intensity a attributed to the (111) plane of silver and peak intensity b attributed to the (220) plane of silver of 2 or less, as measured by powder X-ray diffraction.</p> |
申请公布号 |
WO2013108701(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
WO2013JP50270 |
申请日期 |
2013.01.10 |
申请人 |
TOYO ALUMINIUM KABUSHIKI KAISHA |
发明人 |
KOIKE, KAZUNORI;TAKAYAMA, MIKI;MINAMIYAMA, HIDEAKI;MINAMI, KAZUYA |
分类号 |
H01B5/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B13/00 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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