发明名称 CONDUCTIVE FILLER OF FLAKE FORM
摘要 <p>The present invention provides a conductive filler of flake form which is easy to produce and inexpensive, and which has high conductivity. This conductive filler of flake form is characterized by containing a base material of flake form, and a silver coating which coats the entire surface of the base material of flake form, the base material of flake form containing copper, and the conductive filler of flake form having a ratio a/b of peak intensity a attributed to the (111) plane of silver and peak intensity b attributed to the (220) plane of silver of 2 or less, as measured by powder X-ray diffraction.</p>
申请公布号 WO2013108701(A1) 申请公布日期 2013.07.25
申请号 WO2013JP50270 申请日期 2013.01.10
申请人 TOYO ALUMINIUM KABUSHIKI KAISHA 发明人 KOIKE, KAZUNORI;TAKAYAMA, MIKI;MINAMIYAMA, HIDEAKI;MINAMI, KAZUYA
分类号 H01B5/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B13/00 主分类号 H01B5/00
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