| 摘要 |
<p>When a plating film is formed by a wet plating process on an external electrode provided to a ceramic electronic component, such as a stacked ceramic capacitor, and formed thereon by baking of a conductive paste containing a glass component for example, there are instances in which the glass component situated in the vicinity of end edges of the external electrode is dissolved by the plating solution, resulting in erosion and embrittlement of the component body in the vicinity of the end edges of the external electrode. Glass regions (38, 39) extending at least from the end edges (34, 35) of external electrodes (32, 33) to the vicinity thereof, in which glass containing between 23 mol% and 74 mol%, inclusive, of silicon oxide is present, are formed on the surface of a component body (22). Glass containing between 23 mol% and 74 mol%, inclusive, of silicon oxide has been found to resist dissolution by plating solutions.</p> |
