| 摘要 |
<p>[Problem] To provide a heat conductive member, which is capable of relaxing stress that is generated due to heat generated by an element, and which has high heat conductivity, and to provide a semiconductor device provided with the heat conductive member. [Solution] This heat conductive member is characterized in that: a main protruding portion (12) is configured on a reference surface (11) and/or a rear-side reference surface (14); the main protruding portion (12) is formed on a center portion of the reference surface (11) or that on the rear-side reference surface (14); an area of a leading end portion of the main protruding portion (12) on the reference surface (11) or the rear-side reference surface (14) is 20-90 % of an area of the reference surface (11) or the rear-side reference surface (14); the whole circumference of the reference surface (11) or that of the rear-side reference surface (14), on which the main protruding portion (12) is formed, is lower than the leading end portion; a height difference between a height of a highest portion of the leading end portion and a height of a lowest portion of the circumference is 1/400 or more of a distance between a gravity center of the reference surface (11) or that of the rear-side reference surface (14), and the circumference furthest from the gravity center.</p> |
