发明名称 VACUUM PUMP
摘要 To be provided is a vacuum pump having substrates which can be wired together easily and cooled easily. A substrate unit structure is formed by covering the opening of the casing of the pump main unit 100 with the plate 201 functioning also as the casing of the control unit 200. Pins 207 of a terminal 210 fixed while penetrating the plate 201 are soldered directly to an AMB control substrate 209 and an aerial connection substrate 211 in order to integrate these components. Therefore, the casing and sealing structures can be made simple. Accordingly, a drip-proof structure can be made with the terminal 210 at low cost without using expensive drip-proof connectors 1 and 3. Further, by cooling the plate 201, electronic components mounted respectively on the AMB control substrate 209 in a vacuum atmosphere and the aerial connection substrate 211 in an air atmosphere can be cooled simultaneously.
申请公布号 US2013189089(A1) 申请公布日期 2013.07.25
申请号 US201113877523 申请日期 2011.07.28
申请人 SCHRODER ULRICH;CARRASCO EDUARDO;HENRY BENOIT 发明人 SCHRODER ULRICH;CARRASCO EDUARDO;HENRY BENOIT
分类号 F01D25/00 主分类号 F01D25/00
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