发明名称 POLYMER FOR PRESSURE SENSITIVE ADHESIVE, PRESSURE SENSITIVE ADHESIVE COMPOSITION AND HEAT-PEELABLE PRESSURE SENSITIVE ADHESIVE SHEET
摘要 <p>PURPOSE: A polymer for adhesives and an adhesive composition are provided to prevent a degradation of adhesion under the high temperature atmosphere; maintain a range of proper adhesion; exactly and accurately fix a member or a part on the pedestal. CONSTITUTION: A thermally release adhesive which contains a polymer comprises: in the polymer for adhesives which is comprised with a copolymer with a comonomer which has a double bond capable of copolymerizing with (matte) acryl monomer and (matte) acryl monomer which is indicated as a general formula: CH2=C (R1) COOR2, and in the formula, the R1 is the hydrogen radical or the methyl group, and the R2 is the 1-20 alkyl group of the hydrogen radical or the carbon number; and the comonomer has a ring structure, and the ring structure has more than two carbon atom and more than one double bond and is a monomer which has a characteristic of including more than one kind of atom except carbon; by copolymerizing 1-20 parts by weight of the monomer which has the ring structure base on the 100 parts by weight of the (matte) acryl monomer. The adhesive for the thermally release contains the thermal expansible micro sphere. The thermally release adhesive sheet is comprised by installing a layer which consists the adhesive for the thermally release in the one side or both sides of the basic material.</p>
申请公布号 KR20130084629(A) 申请公布日期 2013.07.25
申请号 KR20130004820 申请日期 2013.01.16
申请人 NITTO DENKO CORPORATION 发明人 ARIMITSU YUKIO;SHIMOKAWA DAISUKE
分类号 C09D133/04;C09D5/20;C09D7/12;C09J7/02 主分类号 C09D133/04
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