发明名称 |
HEAT CONDUCTIVITY IMPROVING AGENT |
摘要 |
The aim of the present invention lies in providing a thermal conduction enhancer which can impart a high level of thermal conduction to a resin. The thermal conduction enhancer according to the present invention comprises, as the effective component, magnesium hydroxide particles having a thickness of 10 nm to 0.2 µm and an aspect ratio (major axis/thickness) measured by SEM of at least 10. |
申请公布号 |
CA2860971(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
CA20132860971 |
申请日期 |
2013.01.18 |
申请人 |
KYOWA CHEMICAL INDUSTRY CO., LTD.;SEA WATER CHEMICAL INSTITUTE, INC. |
发明人 |
MANABE, HITOSHI;KUDO, DAISUKE;OOHORI, KOHEI;MIYATA, SHIGEO |
分类号 |
C09K5/08;C01F5/20;C01F5/22;C08K3/20;C08L83/04;C08L101/00 |
主分类号 |
C09K5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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