发明名称 HEAT CONDUCTIVITY IMPROVING AGENT
摘要 The aim of the present invention lies in providing a thermal conduction enhancer which can impart a high level of thermal conduction to a resin. The thermal conduction enhancer according to the present invention comprises, as the effective component, magnesium hydroxide particles having a thickness of 10 nm to 0.2 µm and an aspect ratio (major axis/thickness) measured by SEM of at least 10.
申请公布号 CA2860971(A1) 申请公布日期 2013.07.25
申请号 CA20132860971 申请日期 2013.01.18
申请人 KYOWA CHEMICAL INDUSTRY CO., LTD.;SEA WATER CHEMICAL INSTITUTE, INC. 发明人 MANABE, HITOSHI;KUDO, DAISUKE;OOHORI, KOHEI;MIYATA, SHIGEO
分类号 C09K5/08;C01F5/20;C01F5/22;C08K3/20;C08L83/04;C08L101/00 主分类号 C09K5/08
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