WIRE DISCHARGE MACHINING DEVICE, WIRE DISCHARGE MACHINING METHOD, THIN-PLATE MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

The purpose of the present invention is to prevent, in end-surface machining, a break of the wire electrode or decrease in the machining surface accuracy caused by inflow of a machining current from a cutting wire part at which discharge is not occurring. This wire discharge machining device is provided with a control means for selecting a cutting wire subjected to application of a pulse voltage by a pulse voltage generation means on the basis of: the angle between the end surface of the machining subject and a surface that is not parallel to the end surface and that includes a plurality of cutting wires; the parallel spacing between the cutting wires; and the relative distances between the cutting wires and the machining subject. A driving means is configured so as to drive the machining subject in a direction that is not perpendicular to the surface including the cutting wires and to cut the machining subject by discharge machining through application of a pulse voltage.