| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which protects a semiconductor chip from magnetic lines concentrating on an end part of a metal shield plate.SOLUTION: A semiconductor device 50 includes: a lead frame having a die pad 52 and a lead 54; a metal shield plate 40 provided on the die pad 52; a semiconductor chip 51 provided on the metal shield plate 40 and connected with the lead 54 through the bonding wire 55; and a resin sealing part 56 sealing the lead frame, the metal shield plate 40, the semiconductor chip 51, and the bonding wire 55. An outer dimension of the metal shield plate 40 is larger than an outer dimension of the semiconductor chip 51. A peripheral edge part of the metal shield plate 40 protrudes to the outer side of the semiconductor chip 51. An entire upper surface of the semiconductor chip 51 is directly bonded to the resin sealing part 56. |
