| 摘要 |
In the semiconductor device including an ESD protection N-type MOS transistor having a sufficient ESD protective function, a drain region of the ESD protection N-type MOS transistor is electrically connected to a drain contact region via a drain extended region. The drain extended region is provided on a side surface and a lower surface of an ESD protection trench isolation region, and is formed of an impurity diffusion region of the same conductivity type as that of the drain region. The drain contact region is formed of an impurity diffusion region of the same conductivity type as that of the drain region.
|
