| 发明名称 |
SENSOR MODULE, PRODUCTION METHOD OF A SENSOR MODULE, AND INJECTION MOLD FOR ENCAPSULATING A SENSOR MODULE |
| 摘要 |
A sensor module an injection mold for covering the sensor module, and to a production method for a covered sensor module including a chip carrier and a sensor chip disposed thereon. A channel is formed between the chip carrier and the sensor chip, by which a medium can be fed to the sensor chip.
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| 申请公布号 |
US2013187295(A1) |
申请公布日期 |
2013.07.25 |
| 申请号 |
US201013512295 |
申请日期 |
2010.11.26 |
| 申请人 |
REITMEIER WILLIBALD;WILDGEN ANDREAS;CONTINENTAL AUTOMOTIVE GMBH |
发明人 |
REITMEIER WILLIBALD;WILDGEN ANDREAS |
| 分类号 |
H01L21/56;H01L23/28 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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