| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip module having redundant I/O connections between dice.SOLUTION: A module comprises: a substrate; at least two cores coupled to the substrate; a plurality of Input/output (I/O) connections between the at least two cores, the plurality of I/O connections including redundant I/O connections; and circuitry operable to reroute a signal from one I/O connection of the plurality of I/O connections to a redundant I/O connection of the plurality of I/O connections on the basis of a determination that the one I/O connection of the plurality of I/O connections is defective. |
