| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation performance for heat generated in a solid state image pickup sensor.SOLUTION: A solid state image pickup device 1 includes: a solid state imaging sensor 4; a package body 3 which has an installation surface 2a, on which the solid state imaging sensor 4 is installed, and a wall surface 2b erected from the installation surface 2a and enclosing the solid state image sensor 4 from the lateral side, the package body 3 housing the solid state image sensor 4; and a filler 6 filling a space between a side surface of the solid state image sensor 4 and the wall surface 2b over an entire periphery or a part of the periphery of the solid state image sensor 4 and having heat conductivity higher than that of air. |
