| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for removing material on a bevel of a wafer.SOLUTION: A wafer support 104 with a diameter that is less than a diameter of a wafer 110 is provided. The wafer support is located on a first side of the wafer, and an outer edge of the wafer extends beyond the wafer support around the wafer. An RF power source 112 is electrically connected to the wafer. A central cover 103 is spaced apart from the wafer support. A first electrically conductive ring 124 is located on the first side of and spaced apart from the wafer. A second electrically conductive ring 132 is spaced apart from the wafer. An electrically conductive liner 144 surrounds the outer edge of the wafer. A switch 148 is located between the liner and ground, allowing the liner to be switched from being grounded to floating. |
