| 摘要 |
PROBLEM TO BE SOLVED: To allow for automation of the entire line of PCB by not only minimizing the removal time of a film while mechanically removing the film adhering to the front and back surfaces of the PCB but also reducing tear or defective peeling of the film during removal process thereof, thereby ensuring efficient work.SOLUTION: The film peeling system for DFSR includes an arrangement unit for arranging PCBs, supplied with a film adhering to the front and back surfaces, on one side of a machine base, a vision unit for positioning the PCBs thus arranged so as to abut against a substrate transfer unit, a PCB transfer unit for transferring the PCB to a peeling position where the film adhering to the PCB thus positioned can be removed and then transferring the PCB to a discharge position, a film removal unit for removing the film adhering to the front and back surfaces of the PCB, a film recovery unit for recovering the film removed from the PCB, and a PCB acceptance unit for accepting the PCB from which the film is removed. |
