发明名称 Packaging Platform For Opto-Electronic Assemblies Using Silicon-Based Turning Mirrors
摘要 An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle theta, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle theta as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.
申请公布号 US2013188970(A1) 申请公布日期 2013.07.25
申请号 US201313745773 申请日期 2013.01.19
申请人 SHASTRI KALPENDU;PATEL VIPULKUMAR;PATHAK SOHAM;CHAKRABARTI UTPAL;DAMA BIPIN;KACHRU RAVINDER;DESAI KISHOR 发明人 SHASTRI KALPENDU;PATEL VIPULKUMAR;PATHAK SOHAM;CHAKRABARTI UTPAL;DAMA BIPIN;KACHRU RAVINDER;DESAI KISHOR
分类号 H04B0010/000012 主分类号 H04B0010/000012
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