发明名称 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To prevent occurrence of a short circuit and a crack in a laminated electronic component with adjacent wires (such as coil conductors) in insulator layers inter-connected through via holes.SOLUTION: A laminate 12 has a structure where a coil-embedded layer comprising first insulator layers and second insulator layers laminated alternately is sandwiched between an upside magnetic substance layer and a downside magnetic substance layer, and external electrodes are formed on both end faces of the laminate. A first coil conductor 34 is formed on each first insulator layer, a second coil conductor 36 is formed on each second insulator layer, and the coil conductors 34, 36 are connected through via holes. A connection conductor 36D having a size sufficiently large to block off the top of the via hole provided in an insulator sheet is formed at the end of each second coil conductor 36. By pressure-bonding the laminate to discharge air in the via hole, the connection conductor 36D has a part filling inside the via hole and a part projecting on the top of the via hole, thereby having a recessed shape at the central part of the via hole.
申请公布号 JP2013145869(A) 申请公布日期 2013.07.25
申请号 JP20120259221 申请日期 2012.11.27
申请人 TAIYO YUDEN CO LTD 发明人 TAKAHASHI OSAMU
分类号 H01F17/00;H01F41/04 主分类号 H01F17/00
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